GREENSBORO – Semiconductor firm Qorvo has won a new contract with the U.S. Department of Defense (DoD). The aim: to further advance the development of copper-pillar-on-GaN flip-chip technology.
The Greensboro-based company will produce copper pillar flip chips to stack die vertically, allowing more space and reducing the weight and cost of the semi-conductors to be used by the DoD. The goal under the three-year contract is to establish a” high-yield, reliable copper” flip-chip GaN MMIC technology, achieving manufacturing readiness by 2022.
“This contract leverages Qorvo’s 30-year investment in GaN and GaAs manufacturing and packaging technology,” said Vijay Balakrishna, Qorvo’s senior director of Research, Infrastructure and Defense products, in a statement. “By maturing today’s copper pillar flip-chip technology and pushing it to new levels of RF performance, Qorvo will increase yields, shorten manufacturing time and significantly reduce costs in both defense and commercial phased array applications.”
The contract is being administered by the Naval Surface Warfare Center, Crane Division, on behalf of the Office of the Secretary of Defense (OSD) Defense-wide Manufacturing Science & Technology (DMS&T).
Earlier this month, the firm reported fiscal fourth-quarter earnings of $50.4 million. Earnings, adjusted for amortization costs and costs related to mergers and acquisitions, were $1.57 per share.
The results beat Wall Street expectations. The average estimate of seven analysts surveyed by Zacks Investment Research was for earnings of $1.32 per share. The chipmaker posted revenue of $787.8 million in the period, also surpassing Street forecasts.
Earnings: Qorvo beats Street with $50M quarter; vTv Therapeutics reports loss
