Ziptronix, a spinoff from RTI International, has signed a patent licensing deal with international electronics giant Sony.
The agreement covers oxide bonding technology that enhances digital image resolution by a variety of electronic devices.
According to Ziptronix, its technology enables digital cameras with up to five mefapixels of resolution can reach 16 megapixels.
“For consumer electronics, this means significant advantages in size reduction, lower power consumption, increased system performance, and better light rendering,” the company said.
Financial terms of the agreement were not disclosed.
Ziptronix is focused on three-dimensional integration technology for semiconductors. RTI, Grotech Capital and Alliance Technology Ventures are among investors in the firm. The company has raised some $35 million in financing.
“We believe that Ziptronix’s patented oxide bonding technology, called ZiBond, enables the industry’s lowest distortion for imaging systems utilizing backside illumination,” said Dan Donabedian, chief executive officer at Ziptronix.
“The result is that pixels can be scaled smaller, resulting in more die per wafer,” he added. “Users of ZiBond technology benefit because yields are dramatically improved and production costs reduced.”
Donabedian said his firm’s technology “revolutionizes how light is received in imaging sensors.”
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