IBM is making available new versions of its silicon germanium chip, one that provides twice the power of the previous version and another that is designed to increase batter life for mobile devices.

The 8HP chip is intended to provide more capabilities for high-bandwidth wireless applications and also help reduce costs of mobile devices, IBM said.

The lower-cost chip, known as 8WL, is targeted at mobile devices to increase battery life and functionality.

“Silicon germanium technology is increasingly influencing next generation consumer devices and applications,” said Bernie Meyerson, the chief technologist for the Systems & Technology Group at IBM. “IBM introduced the technology in 1989 to allow chip designers to increase computer performance. Over the years, SiGe revolutionized the wireless industry by providing a high volume Silicon-based technology. The fourth generation of SiGe will continue to enable wireless connectivity on an increasingly global scale.”