Unitive, a developer of packaging solutions for silicon chip manufacture, has developed a means of producing chips without lead.
The “SnAg” process is described as environmentally friendly, helping Unitive customers to replace lead-based solder.
“This technology was developed and qualified over two years in our U.S. facility then transferred to our Unitive Semiconductor Taiwan (UST) facility in Hsinchu,” said Dan Mis, Unitive’s vice president of technology integration, in a statement. “Clearly this demonstrates our ability to leverage our worldwide development organization to provide customers with the latest technology.”
Unitive said it is the first company to develop such a process.
Unitive has also received production qualification status from Infineon Technologies AG, a German-based semiconductor company that designs, develops, manufactures and markets a broad range of semiconductors and complete system solutions, the company said.