Ziptronix has signed an agreement with Sumitomo Corp. to distribute engineered substrates, MEMS packaging, and 3-D integrated circuits in Japan.

The deal was signed with Sumitomo’s Electronic Materials and Equipment Department.

In September, Ziptronix announced the first in a line of Engineered Substrate products based on the company’s ZiROC bonding technology. This process results in piezoelectric-based Radio Frequency filters that offer frequency stability for applications in cell phones, wireless LAN devices and other wireless communication devices.

“Response to our ZiROC engineered substrate technology has been quite favorable,” said Doug Milner, president and CEO of Ziptronix. “These materials enable the manufacture of a new class of components that were never possible before. Our agreement with Sumitomo allows Ziptronix to bring these solutions to the highly innovative Japanese market.”