Editor’s note: Dan Krueger is General Chair of the IMAPS (International Microelectronics Assembly and Packaging Society) 2017 event taking place in Raleigh through Oct. 12 at the Convention Center. Here is his “welcome” letter for the event.
RALEIGH – Welcome to the IMAPS 50th Annual International Symposium on Microelectronics. …
You will find a IMAPS 2017 program with technical sessions balancing between emerging, new and mature topics, and a large cross-section of vendors exhibiting their products and technologies in the exhibition hall.
The IMAPS committees and many dedicated volunteers have been working together over the past six months to prepare for the 2017 Symposium with an emphasis on bringing exciting topics that are relevant within the microelectronics community. This year’s technical committee, chaired by Mary Cristina Ruales Ortega, has prepared technical sessions with topics on: fan-out wafer level packaging; embedded packaging; heterogeneous & complex system packaging; advanced CMOS nodes; miniaturization of bio-devices; 3D technologies; wire bonding; additive manufacturing; materials; and much more.
Complementing the technical sessions, we are also planning multiple Professional Development Courses (PDCs) with variety of topics bound to enhance and broaden your technical portfolio. This will be held on Monday, October 9, prior to the kick-off of the technical sessions.
The IMAPS Exhibition returns featuring a 2-day show floor with more than 120 exhibit booths, featuring companies and research labs that will showcase a vast array of new products serving all segments of the microelectronics industry, including Consumer, Healthcare and Biomedical, Military, Aerospace, Computing, and Automotive/Industrial. Browsing the exhibit hall and talking to the exhibitors are bound to be exciting and we hope that this enables you to learn the latest and greatest solutions to the changing needs in your business and research.
We hope you can take some time from your busy schedules to attend IMAPS 2017 to learn about the changing world of microelectronics packaging in the 21st century.
