Posted Dec. 5, 2013 at 3:55 p.m.

Premium Lock Conference 'encounter' leads to next-generation chip partnership for RTI

Published: 2013-12-05 15:55:00
Updated: 2013-12-05 15:55:00

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An example of QP chip packaging. An example of QP chip packaging. (RTI image) Image 1 of 2 · Next Image…

A two-year business relationship that began at a business conference led to Wednesday's news that RTI is partnering with an Indiana-based semiconductor firm to develop new packaging technology that enables smaller, faster semiconductor chips. Using a proprietary "Quilt" concept, RTI could soon enable 'More Than Moore' devices. The deal is the latest in RTI's efforts to advance semiconductor development and performance....

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