Semiconductor firm Kyma Technologies lands $2.8M contract for chip development
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Local Tech Wire
RALEIGH, N.C. – Semiconductor technology firm Kyma Technologies will receive $2.8 million in funding through a new contract with the Pentagon for chip development.
The funding is to be used for more cost-effective chip materials to be used in next-generation devices.
Kyma (Greek for wave) is working with gallium nitride (GaN) and aluminum nitride (AIN) materials, not traditional silicon (Si). The company is developing technology developed at N.C. State.
The new Department of Defense contract is for GaN development. Kyma is seeking to produce larger GaN substrates in bulk.
“Historically, DOD has led the way in advancing semiconductor materials, creating domestic high tech jobs and supporting the development of entire new industries, while supporting important advances in U.S. defense capabilities,” said Kyma Chief Executive Officer Keith Evans.
“The United States led the way in developing Si, gallium arsenide (GaAs), and indium phosphide (InP), which have enabled over $250 billion in commercial device applications. Unfortunately, the United States has fallen behind in producing GaN materials, which are already more important than GaAs and InP.
“Japan has a major effort in GaN, while recently South Korea and China have begun aggressively pursuing GaN materials capabilities,” he added. “With over $100B in eventual commercial device applications and likely impact on essentially all future defense systems, the United States has a pressing need to develop and maintain a strong domestic GaN manufacturing capability.”
Kyma will work with the U.S. Air Force Research Laboratory on the contract.
The market for GaN and AIN substrates is expected to exceed $500 million this year and more than $30 billion over the next decade, according to Kyma.
Copyright 2012 WRAL Tech Wire. All rights reserved.
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